PS5 Pro Teardown Reveals Cooling, GPU Upgrades
## PS5 Pro Teardown Reveals Enhanced Cooling and Powerful GPU Upgrades
Sony Interactive Entertainment has released an official teardown of the PlayStation 5 Pro, revealing significant internal upgrades focused on cooling and graphical performance. The teardown, featuring insights from PS5 Pro Mechanical Design Lead Shinya Tsuchida and PS5 Pro Electrical Design Lead Shinya Hiromitsu, details enhancements addressing previous generation concerns and showcasing new technological advancements.
Externally, the PS5 Pro boasts three distinctive "blades" – new airflow paths not present in previous PS5 models – improving ventilation while maintaining the familiar PS5 design aesthetic. Internally, a redesigned "louver" between the main unit and cover minimizes fan noise directed towards the user. The rear port placement has also been adjusted to accommodate the high-density circuit design of the larger motherboard. A larger exhaust vent further enhances cooling efficiency.
The cooling system itself has received major attention. The PS5 Pro features a larger fan with redesigned blades for quieter, more efficient airflow. The number of blades remains consistent with previous models, but improvements to blade shape and the addition of smaller blades between each improve performance. To further reduce electromagnetic interference, a metal shield secured with numerous screws encases the motherboard.
The motherboard itself is significantly larger than its predecessors, reflecting the increased circuitry required for enhanced performance. While the original PS5's liquid metal thermal interface material (TIM) proved successful, the PS5 Pro features added fine grooves in the liquid metal application area to improve cooling stability and address previous concerns regarding potential leaks. This builds on earlier research anticipating denser semiconductors and highlighting the crucial role of liquid metal technology in future console designs.
The PS5 Pro's System-on-a-Chip (SoC) is enhanced for high-resolution, high-frame-rate graphics, including support for PlayStation Spectral Super Resolution (PSSR). Power delivery lines have also been upgraded. The motherboard incorporates additional internal layers, resulting in faster memory performance, barely visible surface traces, and an increase from eight to nine RAM chips. A ninth DDR5 memory chip is dedicated to slower processing tasks, freeing up the eight GDDR6 chips for high-speed rendering. The GDDR6 RAM itself is also faster than in previous PS5 models.
Finally, the PS5 Pro includes a Wi-Fi 7 module, reflecting Sony's commitment to adopting the latest technologies for optimal performance and future-proofing the console. The larger power supply unit, outputting 48W more power than the current PS5 model, reflects the increased power demands of the upgraded components. The improved cooling system and powerful components combine to create what Sony describes as the most powerful console on the market.
Sony Interactive Entertainment has released an official teardown of the PlayStation 5 Pro, revealing significant internal upgrades focused on cooling and graphical performance. The teardown, featuring insights from PS5 Pro Mechanical Design Lead Shinya Tsuchida and PS5 Pro Electrical Design Lead Shinya Hiromitsu, details enhancements addressing previous generation concerns and showcasing new technological advancements.
Externally, the PS5 Pro boasts three distinctive "blades" – new airflow paths not present in previous PS5 models – improving ventilation while maintaining the familiar PS5 design aesthetic. Internally, a redesigned "louver" between the main unit and cover minimizes fan noise directed towards the user. The rear port placement has also been adjusted to accommodate the high-density circuit design of the larger motherboard. A larger exhaust vent further enhances cooling efficiency.
The cooling system itself has received major attention. The PS5 Pro features a larger fan with redesigned blades for quieter, more efficient airflow. The number of blades remains consistent with previous models, but improvements to blade shape and the addition of smaller blades between each improve performance. To further reduce electromagnetic interference, a metal shield secured with numerous screws encases the motherboard.
The motherboard itself is significantly larger than its predecessors, reflecting the increased circuitry required for enhanced performance. While the original PS5's liquid metal thermal interface material (TIM) proved successful, the PS5 Pro features added fine grooves in the liquid metal application area to improve cooling stability and address previous concerns regarding potential leaks. This builds on earlier research anticipating denser semiconductors and highlighting the crucial role of liquid metal technology in future console designs.
The PS5 Pro's System-on-a-Chip (SoC) is enhanced for high-resolution, high-frame-rate graphics, including support for PlayStation Spectral Super Resolution (PSSR). Power delivery lines have also been upgraded. The motherboard incorporates additional internal layers, resulting in faster memory performance, barely visible surface traces, and an increase from eight to nine RAM chips. A ninth DDR5 memory chip is dedicated to slower processing tasks, freeing up the eight GDDR6 chips for high-speed rendering. The GDDR6 RAM itself is also faster than in previous PS5 models.
Finally, the PS5 Pro includes a Wi-Fi 7 module, reflecting Sony's commitment to adopting the latest technologies for optimal performance and future-proofing the console. The larger power supply unit, outputting 48W more power than the current PS5 model, reflects the increased power demands of the upgraded components. The improved cooling system and powerful components combine to create what Sony describes as the most powerful console on the market.
